Mil-t-10727 Pdf

If the number of nonconforming articles exceeds the acceptance number for the sample, the lot represented by the sample shall be rejected. Sheet, strip, or wire test specimens shall be essentially of the same composition basis metal, heat treatment, condition, and surface finish of the articles represented, prior to plating. Instructions to bidders of Saudi Electricity Company. Following fracture of the basis metal, it shall not be possible to detach any areas of the coatings with a sharp instrument. If bright tin plating is soldered, the codeposited organics in the deposit can burn, resulting in a dewetting of the solder and a visible charring of the solder joint.


All basis metal shall be subjected to appropriate cleaning and oxide removal procedures to ensure deposition of adherent deposits. The measurements shall be made in representative locations on each item and the item shall be considered defective if one or more of the measurements fail to meet the specified minimum thickness.

The parts shall be packaged and packed in accordance with the applicable item specification. If the items in a lot are four or less, the number of items in the sample shall be determined by the. Inspection records of the examinations and tests shall be kept complete and available to the Government if specified in the contract or order. Sealed nitrogen bag packaging can be provided in which plated products are heat sealed in a pure nitrogen-filled bag to prevent oxidation of the tin deposit. In addition, reflow of tin deposits can help minimize but not fully prevent the formation of tin whiskers.

The basis metal shall be substantially free from flaws or defects that will be detrimental to the appearawe or the protective value of the coating. Ubiquitous Computing and Communication Journal.


Bright tin and matte solderable tin. Unless otherwise specified in the contract, the contractor is responsible for the performance of all inspection requirements as specified herein. If any item fails tO pass any test, the lot which the sample represents in the Sample shall be considred defective, and shall be cause for rejection of the lot. Thickness of tin plating d. With this method the solderability shelf-life can be extended to over ten times that of parts packed with traditional methods.

Unless otherwise specified, sampling shall be in accor. Tin is a soft, ductile, silvery-white metal that is not easily oxidized in air.

If the number of defective items in any sample exceeds the acceptance number for the specified sample, the lot represented by the sample shall be rejected. The interface between the tin and basis metal is the surface of the basis metal.

MIL-T-10727 vs. ASTM B545

How do I make a solderable deposit or What type of tin plating should I use for my application in our Plating Topics section. Tin is generally considered non-toxic and non-carcinogenic and as such its use is generally approved for food contact applications.

MIL-T-10727 vs. ASTM B545




The method or instrument used for determining the coating thickness shall be of a type approved by the procurinq FiCti-Vity-. Both deposits are electrolytically applied. The part or article shall be considered nonconforming if one or more measurements fail to meet the specified minimum thickness. Specimens may be used for more than one test where applicable.

Artistic recommends the use of an unbrightened nickel deposit such as sulfamate nickel as a diffusion barrier as it affords an excellent solder base for soldering applications. Unless otherwise indicated, the issue in effect on date of invitation for bids or request for proposal shall apply.

The following documents form a part of this specification to the extent specified herein. Problemas Ecuaciones Diferenciales Ordinarias.

MIL-T datasheet & applicatoin notes - Datasheet Archive

This specification covers the requirements for electrodeposited tin and hot-dipped tin coatings on ferrous and nonferrous metals. Title, number, and date of this specification.

Separate specimens shall not be used for thickness measurements, however, unless the necessity for their use has been demonstrated. It has good conductivity and corrosion resistance while enhancing solderability of substrates that are not otherwise easily soldered to. Tin deposits can have the potential to form filiform tin whiskers that propagate from the surface of the deposit. If the plating thickness at any one place on any one item is less than the specified minimum, the lot shall be rejected. Asterisks are not to identify changes with respect to the previous issue, visual basic 6.0 database connectivity ms access pdf ness of the changes.

Popular in Science And Technology. For purpose of this requirement, a corroded area is defined as exposure or corro- sion of the basis metal.

Bright tin plating has a high degree of luster and is generally preferred for electrical contact applications such as bus bars, terminals and switching components that are not soldered to. It is important to note that solderability of tin plated products is a perishable attribute that has a finite life. The coating shall be lustrous, smooth, fine-grained, adherent, and free from blisters, pits, nodules, indications of burning and other defects.